KNUCKLE-JOINT
THD-45
Target Applications
- High-density, multi-cavity electronic terminal forming applications requiring extended pressure holding at Bottom Dead Center (BDC) for improved forming accuracy, material stability, and consistent production quality.
- Ultra-precision micro stamping for thin-wall smartphone connector components, micro switches, precision terminals, and miniature electronic parts requiring high repeatability and superior dimensional accuracy.
Brochure available for download at the bottom of this page.
THD-60
Target Applications
- High-density, multi-cavity electronic terminal forming applications requiring extended pressure holding at Bottom Dead Center (BDC) for improved forming accuracy, material stability, and consistent production quality.
- Ultra-precision micro stamping for thin-wall smartphone connector components, micro switches, precision terminals, and miniature electronic parts requiring high repeatability and superior dimensional accuracy.
Brochure available for download at the bottom of this page.
THD-80
Target Applications
- High-density, multi-cavity electronic terminal forming applications requiring extended pressure holding at Bottom Dead Center (BDC) for improved forming accuracy, material stability, and consistent production quality.
- Ultra-precision micro stamping for thin-wall smartphone connector components, micro switches, precision terminals, and miniature electronic parts requiring high repeatability and superior dimensional accuracy.
Brochure available for download at the bottom of this page.